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Aiming at the requirements of high integration, miniaturization and multi-beam of X-band multi-beam active phased array system, a highly integrated and miniaturized tile-type eight-beam receiving component is designed. The component is based on multi-layer printed circuit board technology. The high-density layout of many active devices and eight sets of beam combined network is realized vertically, and the high integration of the component is realized. Aiming at the eight-beam synthesis requirement of the module, a miniaturized broadband combining network is designed based on the form of Wilkinson power divider. In the range of 7.5-9 GHz, the insertion loss is less than 1 dB, the isolation between ports is less than-20 dB, and the standing wave ratio is less than 1.2. The amplitude and phase consistency between channels is good. In order to reduce the transmission loss of the signal inside the component, the vertical interconnection structure inside the component is modeled and analyzed, and the influence of different structural parameters on its transmission performance is obtained. The low loss transmission of the signal is realized by optimizing the structural parameters. On this basis, the module is fabricated and tested. In the range of 7.5-9 GHz, the output channel gain of the module is greater than 18 dB, the output standing wave ratio is less than 1.5, the phase consistency between channels is less than ± 5 °, and the size is only 80 mm × 80 mm × 7.66 mm.