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In the absence of cooling measures, the wafer thermal of high power LED rises rapidly. When the junction thermal exceeds the maximum allowable thermal, the high power LED will be damaged due to overheating. In the design of high power LED lamps, the main work is to the thermal design. Using a good linear relationship characteristic of the semiconductor devices between the LED junction voltage and junction thermal, this paper measured the high-power LED working voltage, working current, thermal of the incubator and heat sink. Adopting the method of electrical parameters, the paper measure the thermal resistor of high power LED. The high-power LED thermal resistance measuring instrument is designed and made. The thermal resistance from the LED wafer to the heat sink is measured fast and accurately, and the error is less than 10%. The measured value of the thermal resistor is generally higher than the theoretical calculated value. It shows that the LED manufacturing technology level can be improved.